Invention Grant
- Patent Title: Patterning method
- Patent Title (中): 图案化方法
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Application No.: US12549232Application Date: 2009-08-27
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Publication No.: US08221827B2Publication Date: 2012-07-17
- Inventor: Hiroshi Tokue , Ikuo Yoneda , Shinji Mikami , Takumi Ota
- Applicant: Hiroshi Tokue , Ikuo Yoneda , Shinji Mikami , Takumi Ota
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2008-240760 20080919
- Main IPC: B05D5/00
- IPC: B05D5/00

Abstract:
A patterning method according to an embodiment of the present invention comprises: acquiring information about a surface state of an underlying film formed on a substrate; determining, based on the surface state, whether irregularity/foreign matter is present in each shot region in which a pattern is to be formed; and solidifying a resist agent while a first template, when it is determined that no irregularity/foreign matter is present in the shot region, or a second template that is different from the first template, when it is determined that irregularity/foreign matter is present in the shot region, is brought close to the underlying film on the shot region at a certain distance with the resist agent therebetween.
Public/Granted literature
- US20100072647A1 PATTERNING METHOD Public/Granted day:2010-03-25
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