Invention Grant
- Patent Title: Material for heat resistant component
- Patent Title (中): 耐热元件材料
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Application No.: US11887254Application Date: 2006-03-28
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Publication No.: US08221901B2Publication Date: 2012-07-17
- Inventor: Hiroshi Harada , Akihiro Sato , Kyoko Kawagishi
- Applicant: Hiroshi Harada , Akihiro Sato , Kyoko Kawagishi
- Applicant Address: JP Ibaraki
- Assignee: National Institute for Materials Science
- Current Assignee: National Institute for Materials Science
- Current Assignee Address: JP Ibaraki
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2005-092542 20050328
- International Application: PCT/JP2006/306268 WO 20060328
- International Announcement: WO2006/104138 WO 20061005
- Main IPC: B32B15/01
- IPC: B32B15/01 ; C23C30/00
Abstract:
A heat resistant material, wherein one type or plural types of materials that do not generate interdiffusion with an Ni-based superalloy are coated on the Ni-based superalloy to prevent the interdiffusion of elements through the substrate/coating interface even at such high temperatures as 1100° C. or above 1100° C., is provided.
Public/Granted literature
- US20080226937A1 Material for Heat Resistant Component Public/Granted day:2008-09-18
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