Invention Grant
- Patent Title: Semiconductor device and method of making semiconductor device
- Patent Title (中): 半导体器件及制造半导体器件的方法
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Application No.: US11863759Application Date: 2007-09-28
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Publication No.: US08222079B2Publication Date: 2012-07-17
- Inventor: John U. Knickerbocker , Chirag S. Patel
- Applicant: John U. Knickerbocker , Chirag S. Patel
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor device includes a carrier, a semiconductor chip formed on the carrier, and a micro-chip which is electrically connected to the chip, and includes a thickness which is less than a thickness of the chip.
Public/Granted literature
- US20090085217A1 SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE Public/Granted day:2009-04-02
Information query
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