Method of fabricating semiconductor device

Invention Grant

US08222109B2 Method of fabricating semiconductor device 有权

Title translation: 制造半导体器件的方法

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Patent Title: Method of fabricating semiconductor device
Patent Title (中): 制造半导体器件的方法
Application No.: US12760152

Application Date: 2010-04-14
Publication No.: US08222109B2

Publication Date: 2012-07-17
Inventor: Hideo Yamamoto , Kei Takehara
Applicant: Hideo Yamamoto , Kei Takehara
Applicant Address: JP Kanagawa
Assignee: Renesas Electronics Corporation
Current Assignee: Renesas Electronics Corporation
Current Assignee Address: JP Kanagawa
Agency: Foley & Lardner LLP
Priority: JP2009-107347 20090427
Main IPC: H01L21/8242
IPC: H01L21/8242 ; H01L21/336

Method of fabricating semiconductor device

Abstract:

A method of fabricating a semiconductor device according to the present invention includes forming a first trench and a second trench by etching the first trench further, in an epitaxial layer formed over a substrate, extending a width of the second trench, forming an oxidize film by oxidizing the extended second trench, and filling an electrode material in the first trench and the second trench including the oxidized film formed therein. The method of fabricating a semiconductor device according to the present invention enables to fabricate a semiconductor device that improves the withstand voltage between a drain and a source and reduce the on-resistance.

Abstract(Chinese):

根据本发明的制造半导体器件的方法包括通过在形成在衬底上的外延层中进一步蚀刻第一沟槽来形成第一沟槽和第二沟槽，延伸第二沟槽的宽度，通过第二沟槽的宽度形成氧化膜氧化延伸的第二沟槽，并且填充第一沟槽中的电极材料和包括其中形成的氧化膜的第二沟槽。根据本发明的制造半导体器件的方法能够制造提高漏极和源极之间的耐受电压并降低导通电阻的半导体器件。

Public/Granted literature

US20100273304A1 METHOD OF FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2010-10-28

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8239	........存储器结构
H01L21/8242	.........动态随机存取存储结构（DRAM）