Invention Grant
- Patent Title: Wet friction material
- Patent Title (中): 湿摩擦材料
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Application No.: US12740274Application Date: 2008-10-02
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Publication No.: US08222317B2Publication Date: 2012-07-17
- Inventor: Toshihiko Kozutsumi
- Applicant: Toshihiko Kozutsumi
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-280727 20071029
- International Application: PCT/JP2008/067895 WO 20081002
- International Announcement: WO2009/057414 WO 20090507
- Main IPC: C08J5/14
- IPC: C08J5/14

Abstract:
The purpose of the present invention is to provide a wet friction material which has a high coefficient of friction, has reduced overall thickness change, and excellent heat resistance (resistance to heat spots). In order to accomplish the purpose, the present invention provides a wet friction material prepared by impregnating a base material including a fibrous substance with a thermosetting resin, and then thermally curing it, wherein the aspect ratio of the fibrous substance is 10 or higher, and the fibrous substance is contained in the base material in an amount of 60 to 75 weight %.
Public/Granted literature
- US20100256259A1 WET FRICTION MATERIAL Public/Granted day:2010-10-07
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