Invention Grant
- Patent Title: Multi-piece coverplate assembly and modular device assembly
- Patent Title (中): 多件式盖板组件和模块化装置组装
-
Application No.: US12513604Application Date: 2008-06-18
-
Publication No.: US08222521B2Publication Date: 2012-07-17
- Inventor: Eddie Kimbrell , Ted Lichoulas
- Applicant: Eddie Kimbrell , Ted Lichoulas
- Applicant Address: US SC Spatanburg
- Assignee: AFL Telecommunications LLC
- Current Assignee: AFL Telecommunications LLC
- Current Assignee Address: US SC Spatanburg
- Agency: Sughrue Mion, PLLC
- International Application: PCT/US2008/067297 WO 20080618
- International Announcement: WO2008/157579 WO 20081224
- Main IPC: H02G3/14
- IPC: H02G3/14
Abstract:
A multi-piece coverplate assembly provides a multi-piece coverplate and modular device assembly which is removably fastened to the multi-piece coverplate.
Public/Granted literature
- US20100186986A1 MULTI-PIECE COVERPLATE ASSEMBLY AND MODULAR DEVICE ASSEMBLY Public/Granted day:2010-07-29
Information query
IPC分类:
