Invention Grant
- Patent Title: Wired circuit board assembly sheet
- Patent Title (中): 有线电路板组装板
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Application No.: US12654101Application Date: 2009-12-10
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Publication No.: US08222530B2Publication Date: 2012-07-17
- Inventor: Saori Ishigaki
- Applicant: Saori Ishigaki
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2009-003872 20090109
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A wired-circuit-board assembly sheet includes a plurality of wired circuit boards and a supporting sheet for supporting the wired circuit boards in an aligned state. Each of the wired circuit boards includes a distinguishing mark forming portion to be formed with a distinguishing mark for distinguishing between defectiveness and non-defectiveness of the wired circuit board. The distinguishing mark forming portion is divided by a weir portion for preventing the distinguishing mark from flowing out from the distinguishing mark forming portion.
Public/Granted literature
- US20100175913A1 Wired circuit board assembly sheet Public/Granted day:2010-07-15
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