Invention Grant
- Patent Title: Method for manufacturing a wiring board
- Patent Title (中): 线路板制造方法
-
Application No.: US13150691Application Date: 2011-06-01
-
Publication No.: US08222532B2Publication Date: 2012-07-17
- Inventor: Shigetsugu Muramatsu , Yasuhiko Kusama
- Applicant: Shigetsugu Muramatsu , Yasuhiko Kusama
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2006-324126 20061130
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H01K3/10
Abstract:
A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof.
Public/Granted literature
- US20110253422A1 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-10-20
Information query
