Invention Grant
- Patent Title: Wiring board and method for manufacturing the same
- Patent Title (中): 接线板及其制造方法
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Application No.: US12490409Application Date: 2009-06-24
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Publication No.: US08222539B2Publication Date: 2012-07-17
- Inventor: Yoichiro Kawamura , Keisuke Shimizu
- Applicant: Yoichiro Kawamura , Keisuke Shimizu
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A wiring board has a conductive pattern, an electronic component connected to the conductive pattern by means of a via hole, and a substrate where the electronic component is built into. The connection interface between the via hole and the electronic component inclines toward the connection interface between the via hole and the conductive pattern.
Public/Granted literature
- US20100155124A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-06-24
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