An electronic device includes at least a substrate, an area on the substrate which has to be protected against moisture and/or oxygen, at least one contact, and an encapsulation layer system including at least a first inorganic layer. The at least one contact extends from the sealed area to a part of the substrate not sealed by the encapsulation layer system. The contact includes a shunt, which is an interruption bridged by an electrically conductive bridge. The first inorganic layer of the encapsulation system is applied so that it is in direct physical contact with the electrically conductive bridge. The bridge has a structure and shape which can be sealingly covered by the encapsulation layer system and is made from a material through which no moisture and/or oxygen can penetrate.