Invention Grant
US08222659B2 Semiconductor light-emitting device and method for manufacturing the same 有权
半导体发光装置及其制造方法

  • Patent Title: Semiconductor light-emitting device and method for manufacturing the same
  • Patent Title (中): 半导体发光装置及其制造方法
  • Application No.: US12632404
    Application Date: 2009-12-07
  • Publication No.: US08222659B2
    Publication Date: 2012-07-17
  • Inventor: Katsuhiro Tomoda
  • Applicant: Katsuhiro Tomoda
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: SNR Denton US LLP
  • Priority: JP2008-317083 20081212
  • Main IPC: H01L21/02
  • IPC: H01L21/02
Semiconductor light-emitting device and method for manufacturing the same
Abstract:
A semiconductor light-emitting device includes (A) a light-emitting portion obtained by laminating in sequence a first compound semiconductor layer, an active layer, and a second compound semiconductor layer; (B) a first electrode electrically connected to the first compound semiconductor layer; (C) a transparent conductive material layer formed on the second compound semiconductor layer; (D) an insulating layer composed of a transparent insulating material and having an opening, the insulating layer being formed on the transparent conductive material layer; and (E) a second electrode that reflects light from the light-emitting portion, the second electrode being formed on the transparent conductive material layer and on the insulating layer in a continuous manner, wherein, assuming that areas of the active layer, the transparent conductive material layer, the insulating layer, and the second electrode are respectively S1, S2, S3, and S4, S1≦S2
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