A light emitting diode contains a package structure and a light emitting diode die embedded in the package structure. The package structure has an elliptic bottom surface having a semi-major axes and a semi-minor axis and a semi-ellipsoidal surface connecting and surrounding the edge of the elliptic bottom surface, wherein the maximum height of the ellipsoidal surface from the elliptic bottom surface is between the semi-major axes and the semi-minor axis.