Invention Grant
- Patent Title: Semiconductor integrated circuit device and a method of manufacturing the same
- Patent Title (中): 半导体集成电路器件及其制造方法
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Application No.: US13097731Application Date: 2011-04-29
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Publication No.: US08222686B2Publication Date: 2012-07-17
- Inventor: Shoji Shukuri
- Applicant: Shoji Shukuri
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2002-115924 20020418
- Main IPC: H01L29/788
- IPC: H01L29/788

Abstract:
A semiconductor device having a nonvolatile memory cell which includes a semiconductor substrate, a first insulating film formed over the semiconductor substrate, a control electrode formed over the first insulating film, the first insulating film acting as a gate insulator for the control gate electrode, a second insulating film formed over the semiconductor substrate, and a memory gate electrode formed over the second insulating film and being adjacent to the control gate electrode, the second insulating film acting as a gate insulator for the memory gate electrode and featuring a non-conductive charge trap film, the control gate electrode having a different type conductivity than that of the memory gate electrode. A manufacturing technique for a semiconductor device including a nonvolatile memory cell having control gate and memory gate electrodes is also featured.
Public/Granted literature
- US20110198681A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-08-18
Information query
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