Invention Grant
- Patent Title: Semiconductor die package and method for making the same
- Patent Title (中): 半导体管芯封装及其制造方法
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Application No.: US12366039Application Date: 2009-02-05
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Publication No.: US08222718B2Publication Date: 2012-07-17
- Inventor: Armand Vincent C. Jereza , Paul Armand Calo , Erwin Victor R. Cruz
- Applicant: Armand Vincent C. Jereza , Paul Armand Calo , Erwin Victor R. Cruz
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Hiscock & Barclay, LLP
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
Public/Granted literature
- US20100193921A1 SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME Public/Granted day:2010-08-05
Information query
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