Invention Grant
- Patent Title: Heat spreader having single layer of diamond particles and associated methods
- Patent Title (中): 散热器具有单层金刚石颗粒和相关方法
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Application No.: US12873117Application Date: 2010-08-31
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Publication No.: US08222732B2Publication Date: 2012-07-17
- Inventor: Chien-Min Sung
- Applicant: Chien-Min Sung
- Applicant Address: TW Hsin Chu Industrial Park
- Assignee: RiteDia Corporation
- Current Assignee: RiteDia Corporation
- Current Assignee Address: TW Hsin Chu Industrial Park
- Agency: Thorpe North & Western LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/10
Abstract:
A heat spreader is presented which can provide effective thermal management in a cost effective manner. The heat spreader includes a plurality of diamond particles arranged in a single layer surrounded by a metallic mass. The metallic mass cements the diamond particles together. The layer of diamond particles is a single particle thick. Besides the single layer of diamond particles, the metallic mass has substantially no other diamond particles therein. A thermal management system including a heat source and a heat spreader is also presented, along with methods for making and methods for use of such heat spreaders.
Public/Granted literature
- US20110056672A1 Heat Spreader Having Single Layer of Diamond Particles and Associated Methods Public/Granted day:2011-03-10
Information query
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