Invention Grant
US08222735B2 Semiconductor device and communication system using the semiconductor device
有权
半导体器件和使用该半导体器件的通信系统
- Patent Title: Semiconductor device and communication system using the semiconductor device
- Patent Title (中): 半导体器件和使用该半导体器件的通信系统
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Application No.: US11546465Application Date: 2006-10-12
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Publication No.: US08222735B2Publication Date: 2012-07-17
- Inventor: Yutaka Shionoiri
- Applicant: Yutaka Shionoiri
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2005-300971 20051014
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
With respect to a semiconductor device which communicates data by wireless communication, an object of the present invention is to improve sensitivity of an antenna and to protect a chip from noise without increasing the size of the device. A coiled antenna and a semiconductor integrated circuit which is electrically connected to the coiled antenna are included. The semiconductor integrated circuit is arranged so as to overlap with the coiled antenna. In this manner, arrangement of the coiled antenna and the semiconductor integrated circuit in the semiconductor device is devised, so that sensitivity of the antenna can be improved and power enough to operate the semiconductor integrated circuit can be obtained without increasing the size of the device.
Public/Granted literature
- US20070085202A1 Semiconductor device and communication system using the semiconductor device Public/Granted day:2007-04-19
Information query
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