Invention Grant
- Patent Title: Semiconductor module with current connection element
- Patent Title (中): 具有电流连接元件的半导体模块
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Application No.: US11693379Application Date: 2007-03-29
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Publication No.: US08222741B2Publication Date: 2012-07-17
- Inventor: Reinhold Bayerer , Guido Strotmann , Dirk Froebus , Reinhold Spanke
- Applicant: Reinhold Bayerer , Guido Strotmann , Dirk Froebus , Reinhold Spanke
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006014582 20060329
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A semiconductor module having a current connection element designed for a high current carrying capability is disclosed. In one embodiment, the current connection element includes a plurality of metal layers which rest directly on one another.
Public/Granted literature
- US20070228413A1 SEMICONDUCTOR MODULE Public/Granted day:2007-10-04
Information query
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