A stacked-type piezoelectric device includes a stack of piezoelectric layers, plural conductive layers, a first contact hole, a second contact hole, and plural insulating portions. The piezoelectric layers are disposed between the conductive layers. The first and second contact holes penetrate the piezoelectric layers and the conductive layers, and each of first and second contact holes is filled with a conductive material. Every insulating portion is formed at one conductive layer. Two adjacent insulating portions are respectively formed at the outer rims of the first and second contact holes, to electrically isolate the conductive layer (in which the insulating portion is formed) from the conductive material in the contact hole.