Invention Grant
- Patent Title: Multilayer capacitor
- Patent Title (中): 多层电容器
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Application No.: US12629473Application Date: 2009-12-02
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Publication No.: US08223471B2Publication Date: 2012-07-17
- Inventor: Masaaki Togashi
- Applicant: Masaaki Togashi
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-009961 20090120
- Main IPC: H01G2/20
- IPC: H01G2/20 ; H01G4/005

Abstract:
A multilayer capacitor is provided which can efficiently prevent chattering noises from occurring in a simple structure.In the multilayer capacitor, a metal terminal is disposed about a capacitor element body. Even when an electrostrictive vibration is generated in the multilayer capacitor upon voltage application, a joint surface joining a substrate connecting surface and a terminal connecting surface together in the metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. In the multilayer capacitor, the terminal connecting surface and joint surface form a rising part having a height which is about half that of the capacitor element body. Therefore, the joint surface joins together the terminal connecting surface and substrate connecting surface that are positioned on different side faces of the capacitor element body, whereby a sufficient length can be secured in the joint surface, thus improving the efficiency of mitigating electrostrictive vibrations. Further, a simple procedure of just mounting the bottom face of the capacitor element body onto the front side of the capacitor element body supporting surface can easily attach the metal terminal to the capacitor element body.
Public/Granted literature
- US20100182732A1 MULTILAYER CAPACITOR Public/Granted day:2010-07-22
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