Invention Grant
- Patent Title: Electronic device cooling system
- Patent Title (中): 电子设备冷却系统
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Application No.: US12354683Application Date: 2009-01-15
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Publication No.: US08223495B1Publication Date: 2012-07-17
- Inventor: Andrew B. Carlson , William Hamburgen
- Applicant: Andrew B. Carlson , William Hamburgen
- Applicant Address: US CA Mountain View
- Assignee: Exaflop LLC
- Current Assignee: Exaflop LLC
- Current Assignee Address: US CA Mountain View
- Agency: Fish & Richardson P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; F25D23/12 ; F28F7/00 ; F28D15/00
Abstract:
Cooling systems for providing cooled air to electronic devices are described. The systems can include large storage tanks or waste treatment systems to improve the efficiency of the plant and reduce impact on the environment.
Information query
