Invention Grant
- Patent Title: Thermal bridge extensions for a module-chassis interface
- Patent Title (中): 模块 - 机箱接口的热桥扩展
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Application No.: US12557277Application Date: 2009-09-10
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Publication No.: US08223497B2Publication Date: 2012-07-17
- Inventor: Lance LeRoy Sundstrom , Michael Gillespie , Randolph Hook
- Applicant: Lance LeRoy Sundstrom , Michael Gillespie , Randolph Hook
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A module for use with an expandable wedge clamp assembly in a chassis channel is provided. The module comprises a first side, a second side, a first extension attached to the first side, and a second extension attached to the second side. The first extension and the second extension are flexible. When the wedge clamp assembly is expanded, the first extension and the second extension flex from a first position to a second position. When the wedge clamp is returned from the expanded position to a relaxed position, the first extension and the second extension return from the second position to the first position.
Public/Granted literature
- US20110058336A1 THERMAL BRIDGE EXTENSIONS FOR A MODULE-CHASSIS INTERFACE Public/Granted day:2011-03-10
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