Invention Grant
- Patent Title: Hearing aid device and a method of manufacturing a hearing aid device
- Patent Title (中): 助听器装置及助听器装置的制造方法
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Application No.: US12549450Application Date: 2009-08-28
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Publication No.: US08224006B2Publication Date: 2012-07-17
- Inventor: Frank Beck , James Edward De Finis , Jens-Christian Holst , Harald Klemenz , Lavlesh Lamba , Pei Chyi Kristy Lim , Uwe Rass , Joseph Sauer , Amit Vaze
- Applicant: Frank Beck , James Edward De Finis , Jens-Christian Holst , Harald Klemenz , Lavlesh Lamba , Pei Chyi Kristy Lim , Uwe Rass , Joseph Sauer , Amit Vaze
- Applicant Address: SG Singapore
- Assignee: Siemens Medical Instruments Pte. Ltd.
- Current Assignee: Siemens Medical Instruments Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R31/00
Abstract:
The invention relates to a hearing aid device and a method of manufacturing the hearing aid device. The hearing aid device comprises a housing and a first conductive layer. The housing further comprises a first non-conductive layer and a second non-conductive layer. The first conductive layer is between the first non-conductive layer and the second non-conductive layer.
Public/Granted literature
- US20110051965A1 Hearing aid device and a method of manufacturing a hearing aid device Public/Granted day:2011-03-03
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