Invention Grant
- Patent Title: Inspection apparatus and inspection method
- Patent Title (中): 检验仪器和检验方法
-
Application No.: US12678526Application Date: 2008-09-19
-
Publication No.: US08224063B2Publication Date: 2012-07-17
- Inventor: Akira Kameda , Atsushi Katayama , Ryuji Hamada
- Applicant: Akira Kameda , Atsushi Katayama , Ryuji Hamada
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, LLP.
- Priority: JP2007-256084 20070928
- International Application: PCT/JP2008/002586 WO 20080919
- International Announcement: WO2009/041005 WO 20090402
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
An inspection apparatus and method for precisely detect an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. The inspection apparatus detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an ACF, and includes: a visible light camera which captures an image of a panel recognition mark formed on the panel and a component recognition mark formed on the component; an obtaining unit which obtains, from the image captured by the camera, positions of feature points of the respective recognition marks; and a calculation unit which calculates an amount of misalignment of the feature point of the component recognition mark in the image captured by the camera from a predetermined position that is determined using the position of the feature point of the panel recognition mark as a reference.
Public/Granted literature
- US20100195897A1 INSPECTION APPARATUS AND INSPECTION METHOD Public/Granted day:2010-08-05
Information query