Invention Grant
- Patent Title: Medical device packaging system
- Patent Title (中): 医疗器械包装系统
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Application No.: US11291030Application Date: 2005-11-30
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Publication No.: US08224447B2Publication Date: 2012-07-17
- Inventor: William K. Wenger , Paul G. Krause , William J. Plombon , Steven N. Lu , Sean B. McAdams , Brian B. Lee , Lee Stylos , Judy B. Salzer , G. Jordan Montgomery
- Applicant: William K. Wenger , Paul G. Krause , William J. Plombon , Steven N. Lu , Sean B. McAdams , Brian B. Lee , Lee Stylos , Judy B. Salzer , G. Jordan Montgomery
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Reed A. Duthler; Stephen W. Bauer; Evans M. Mburu
- Main IPC: A61N1/375
- IPC: A61N1/375

Abstract:
A system, comprising a sterilizable package; an implantable medical device placed inside the sterilizable package; and an electrical interface electrically coupled to the implantable medical device and extending from inside the sterilizable package to outside the sterilizable package. In various embodiments, the interface may include package contacts electrically coupled to electrode terminals on the implantable medical device, patient terminals and conductors extending between the package contacts and the patient terminals.
Public/Granted literature
- US20070119741A1 Medical device packaging system Public/Granted day:2007-05-31
Information query
IPC分类: