Invention Grant
US08224724B2 Method and system for associating a collateral agreement with a receivable
有权
将抵押协议与应收款联系起来的方法和制度
- Patent Title: Method and system for associating a collateral agreement with a receivable
- Patent Title (中): 将抵押协议与应收款联系起来的方法和制度
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Application No.: US10810817Application Date: 2004-03-29
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Publication No.: US08224724B2Publication Date: 2012-07-17
- Inventor: Avaneesh Dubey , Sriram Kanuri , Sajeev Khan
- Applicant: Avaneesh Dubey , Sriram Kanuri , Sajeev Khan
- Applicant Address: DE Walldorf
- Assignee: SAP AG
- Current Assignee: SAP AG
- Current Assignee Address: DE Walldorf
- Agency: Kenyon & Kenyon LLP
- Main IPC: G06Q40/00
- IPC: G06Q40/00
Abstract:
Embodiments of the present invention relate to software for automatically forming links between a collateral agreement and receivable secured by the collateral agreement.
Public/Granted literature
- US20050216402A1 Method and system for associating a collateral agreement with a receivable Public/Granted day:2005-09-29
Information query
