Invention Grant
- Patent Title: Lead free frangible bullets
- Patent Title (中): 无铅易碎的子弹
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Application No.: US12575750Application Date: 2009-10-08
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Publication No.: US08225718B2Publication Date: 2012-07-24
- Inventor: Jessu Joys , Barry Anshutz , K. Clive Ramsey
- Applicant: Jessu Joys , Barry Anshutz , K. Clive Ramsey
- Applicant Address: US NJ Flemington
- Assignee: United States Metal Powders Incorporated
- Current Assignee: United States Metal Powders Incorporated
- Current Assignee Address: US NJ Flemington
- Agency: Norris McLaughlin & Marcus, P.A.
- Main IPC: F42B12/22
- IPC: F42B12/22

Abstract:
A lead-free, frangible bullet is provided. The lead-free, frangible bullet is manufactured without sintering or external heating of the bullet. The bullet is prepared by blending a lead-free copper powder mixture and cold compacting the powder in a die to form a bullet. The copper powder can be atomized copper powder, electrolytic copper powder, or a combination of atomized and electrolytic copper powder. The atomized copper powder can be water atomized, air atomized, and combination of water and air atomized. Preferably, the frangible bullet has a fragmentation less than 5 grains.
Public/Granted literature
- US20100083861A1 LEAD FREE FRANGIBLE BULLETS Public/Granted day:2010-04-08
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