Invention Grant
- Patent Title: Radiating fin assembly and thermal module formed therefrom
- Patent Title (中): 辐射翅片组件和由其形成的热模块
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Application No.: US12321001Application Date: 2009-01-14
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Publication No.: US08225846B2Publication Date: 2012-07-24
- Inventor: Sheng-Huang Lin
- Applicant: Sheng-Huang Lin
- Applicant Address: TW Taipei County
- Assignee: Asia Vital Components Co., Ltd.
- Current Assignee: Asia Vital Components Co., Ltd.
- Current Assignee Address: TW Taipei County
- Priority: TW97220653U 20081118
- Main IPC: F28F7/00
- IPC: F28F7/00

Abstract:
A radiating fin assembly includes a plurality of alternately stacked first radiating fins and second radiating fins, such that a V-shaped recession is formed between any two adjacent first and second radiating fins. The V-shaped recessions are defined on at least one of two longitudinal sides of the radiating fin assembly and include a plurality of split spaces, first widened spaces, and second widened spaces. The split spaces are formed at a bottom portion of the V-shaped recessions, and the first and the second widened spaces are formed at two opposite ends of the split spaces. The radiating fin assembly can be associated with at least one heat pipe and a base to form a thermal module. With the V-shaped recessions, the radiating fin assembly and the thermal module can have widened airflow inlets, shortened airflow paths, reduced airflow pressure drop and flowing resistance, and accordingly upgraded heat dissipating efficiency.
Public/Granted literature
- US20100124020A1 Radiating fin assembly and thermal module formed therefrom Public/Granted day:2010-05-20
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