Invention Grant
- Patent Title: Heat dissipation device with heat pipe and elastic member
- Patent Title (中): 带热管和弹性件的散热装置
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Application No.: US12397355Application Date: 2009-03-04
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Publication No.: US08225847B2Publication Date: 2012-07-24
- Inventor: Wei Li , Yi-Qiang Wu
- Applicant: Wei Li , Yi-Qiang Wu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810304464 20080911
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20
Abstract:
A heat dissipation device cooling an electronic device includes a conductive plate, a heat spreader received in the conductive plate and contacting the electronic device, a heat pipe connecting the conductive plate and the heat spreader, and an elastic member mounted on the conductive plate and pushing the heat spreader and the heat pipe in the heat spreader downwardly toward the electronic device.
Public/Granted literature
- US20100059202A1 HEAT DISSIPATION DEVICE Public/Granted day:2010-03-11
Information query
