A blister card package structure with increased support comprising a first card having an inner surface and an outer surface, the first card defining an outer edge, a second card having an inner surface and an outer surface, the second card defining an opening therein and an outer edge, a blister having a body portion and a flange, wherein the body portion extends through the opening in the second card, and wherein the flange is positioned between the inner surfaces of the first and second cards, and an inner frame stiffener positioned between the inner surfaces of the first and second cards, wherein the inner surface of the first card is sealingly connected to the inner surface of the second card along the outer edges of the first and second cards.