Invention Grant
- Patent Title: Removable electronic module
- Patent Title (中): 可移动电子模块
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Application No.: US11713346Application Date: 2007-03-02
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Publication No.: US08226442B2Publication Date: 2012-07-24
- Inventor: Matti Uusimaki , Timo T. Laitinen
- Applicant: Matti Uusimaki , Timo T. Laitinen
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
An electronic module adapted to be removably, operably connected to an electronic device. The electronic module includes a housing; at least one electronic component in the housing; and a plurality of electrical contact areas. The housing has a general electronic card shape with relatively large top and bottom sides and relatively thin side edges between the top and bottom sides. The plurality of electrical contact areas are located on a first one of the side edges. The electrical contact areas are connected to the at least one electronic component such that, when the electronic module is operably connected to the electronic device, the electrical contact areas on the first side edge are adapted to electrically couple the at least one electronic component to the electronic device along the first side edge.
Public/Granted literature
- US20080212291A1 Removable electronic module Public/Granted day:2008-09-04
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