Invention Grant
- Patent Title: Implantable support attachment system and assembly
- Patent Title (中): 植入支撑附件系统和装配
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Application No.: US12943027Application Date: 2010-11-10
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Publication No.: US08226686B2Publication Date: 2012-07-24
- Inventor: Sarah J. Deitch , Daniel J. Dravis , Christopher A. Thierfelder
- Applicant: Sarah J. Deitch , Daniel J. Dravis , Christopher A. Thierfelder
- Applicant Address: DK Humlebaek
- Assignee: Coloplast A/S
- Current Assignee: Coloplast A/S
- Current Assignee Address: DK Humlebaek
- Agency: Coloplast Corp.
- Agent Daniel G. Chapik; Nicholas R. Baumann
- Priority: DK201070096 20100312
- Main IPC: A61B17/04
- IPC: A61B17/04 ; A61B17/08

Abstract:
An attachment assembly configured to secure an implantable support within a patient includes a length of suture, an anchor, a capsule, and a clasp. The suture has a leading end half terminating in a leading end and a trailing end half terminating in a trailing end. The anchor is coupled to the trailing end half of the length of the suture. The capsule is attached to the leading end of the suture and has a through-bore extending longitudinally through the capsule. The clasp is attached to the trailing end of the suture, the clasp attachable to the implantable support.
Public/Granted literature
- US20110224698A1 IMPLANTABLE SUPPORT ATTACHMENT SYSTEM AND ASSEMBLY Public/Granted day:2011-09-15
Information query