Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
- Patent Title (中): 基板加工装置及基板处理方法
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Application No.: US12225241Application Date: 2007-03-06
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Publication No.: US08226771B2Publication Date: 2012-07-24
- Inventor: Fumitoshi Oikawa , Shinji Kajita
- Applicant: Fumitoshi Oikawa , Shinji Kajita
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-078822 20060322
- International Application: PCT/JP2007/054334 WO 20070306
- International Announcement: WO2007/108315 WO 20070927
- Main IPC: B08B3/12
- IPC: B08B3/12 ; B08B11/02
Abstract:
A substrate processing apparatus includes: a polishing device 30A for polishing the surface of a substrate; and at least one of an ultrasonic cleaning device 42 for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, and a two-fluid jet cleaning device 44 for cleaning the surface of the substrate with a two-fluid jet spouted as a mixture of a gas and a liquid. A substrate processing method includes: a polishing step of polishing the surface of a substrate; and a solid matter noncontact cleaning step of cleaning the surface of the substrate by spraying a liquid to the surface of the substrate. The above apparatus and method make it possible to efficiently clean the surface of a substrate after it is polished.
Public/Granted literature
- US20090301518A1 Substrate Processing Apparatus and Substrate Processing Method Public/Granted day:2009-12-10
Information query
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