Invention Grant
US08226805B2 Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same 有权
金属丝电镀用不溶性阳极及使用其的电镀金属线的方法

Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same
Abstract:
An insoluble anode for metal wire electroplating capable of simultaneously electroplating a plurality of metal wires and uniformalizing the electroplating amounts of the metal wires stably for a long time. For realizing these, a plurality of insoluble electrode plates are disposed in a parallel alignment to be placed sandwiching a plurality of wire travel paths from both sides. A plurality of the insoluble electrode plates are tightened and fixed by through-bolts at a plurality of places along the travel path direction. A conductive spacer is interposed in each gap between the insoluble electrode plates at a tightening part by the through-bolt and also a conductive member is provided so as to contact all the electrode plates and the conductive spacers.
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