Invention Grant
- Patent Title: Insoluble anode for metal wire electroplating and method of electroplating metal wire using the same
- Patent Title (中): 金属丝电镀用不溶性阳极及使用其的电镀金属线的方法
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Application No.: US12304490Application Date: 2007-06-29
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Publication No.: US08226805B2Publication Date: 2012-07-24
- Inventor: Kenji Kawaguchi , Ryuichi Otogawa , Kenichi Murakami , Yuji Nakamura
- Applicant: Kenji Kawaguchi , Ryuichi Otogawa , Kenichi Murakami , Yuji Nakamura
- Applicant Address: JP Osaka-shi JP Tokyo
- Assignee: Daiso Co., Ltd.,Bridgestone Corporation
- Current Assignee: Daiso Co., Ltd.,Bridgestone Corporation
- Current Assignee Address: JP Osaka-shi JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-181306 20060630
- International Application: PCT/JP2007/063129 WO 20070629
- International Announcement: WO2008/001892 WO 20080301
- Main IPC: C25B9/02
- IPC: C25B9/02 ; C25B9/06 ; C25C7/02 ; C25D17/10

Abstract:
An insoluble anode for metal wire electroplating capable of simultaneously electroplating a plurality of metal wires and uniformalizing the electroplating amounts of the metal wires stably for a long time. For realizing these, a plurality of insoluble electrode plates are disposed in a parallel alignment to be placed sandwiching a plurality of wire travel paths from both sides. A plurality of the insoluble electrode plates are tightened and fixed by through-bolts at a plurality of places along the travel path direction. A conductive spacer is interposed in each gap between the insoluble electrode plates at a tightening part by the through-bolt and also a conductive member is provided so as to contact all the electrode plates and the conductive spacers.
Public/Granted literature
- US20100025254A1 INSOLUBLE ANODE FOR METAL WIRE ELECTROPLATING AND METHOD OF ELECTROPLATING METAL WIRE USING THE SAME Public/Granted day:2010-02-04
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