An interconnect composite material having a coefficient of thermal expansion close to that of zirconia electrolyte, high electrical conductivity, high stability in both oxidizing and reducing atmosphere at temperatures from 600 to 900° C. and having the following general composition (1−z)[xNi+(1−x−y)TiO2+yNb2O5]+zCuO where x, y and z are corresponding parties of weight. An interconnect plate of this material is manufactured by sintering an intermediate TiO2—Nb2O5 composition, grinding it to a powder, combining the powder with NiO, CuO and an organic binder, tape casting the mixture, stacking the fabricated film into multiple layers, repeated rolling of the multiple layers into sheets and two-step sintering of the sheets in an air atmosphere at the first step and in a hydrogen atmosphere at the final step.