Invention Grant
- Patent Title: Holographic reticle and patterning method
- Patent Title (中): 全息掩模版和图案化方法
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Application No.: US12768405Application Date: 2010-04-27
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Publication No.: US08227150B2Publication Date: 2012-07-24
- Inventor: Shih-Ming Chang , Chung-Hsing Chang , Wen-Chuan Wang , Chi-Lun Lu , Sheng-Chi Chin , Chin-Hsiang Lin , Chun-Kuang Chen
- Applicant: Shih-Ming Chang , Chung-Hsing Chang , Wen-Chuan Wang , Chi-Lun Lu , Sheng-Chi Chin , Chin-Hsiang Lin , Chun-Kuang Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G03F1/00
- IPC: G03F1/00 ; G03C5/00

Abstract:
A hologram reticle and method of patterning a target. A layout pattern for an image to be transferred to a target is converted into a holographic representation of the image. A hologram reticle is manufactured that includes the holographic representation. The hologram reticle is then used to pattern the target. Three-dimensional patterns may be formed in a photoresist layer of the target in a single patterning step. These three-dimensional patterns may be filled to form three-dimensional structures or else used in a multi-surface imaging composition. The holographic representation of the image may also be transferred to a top photoresist layer of a top surface imaging (TSI) semiconductor device, either directly or using the hologram reticle. The top photoresist layer may then be used to pattern an underlying photoresist layer with the image. The lower photoresist layer is used to pattern a material layer of the device.
Public/Granted literature
- US20100297538A1 Holographic Reticle and Patterning Method Public/Granted day:2010-11-25
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