Invention Grant
US08227284B2 Group-III nitride compound semiconductor light-emitting device, method of manufacturing group-III nitride compound semiconductor light-emitting device, and lamp 有权
III族氮化物化合物半导体发光器件,III族氮化物化合物半导体发光器件的制造方法和灯

  • Patent Title: Group-III nitride compound semiconductor light-emitting device, method of manufacturing group-III nitride compound semiconductor light-emitting device, and lamp
  • Patent Title (中): III族氮化物化合物半导体发光器件,III族氮化物化合物半导体发光器件的制造方法和灯
  • Application No.: US12373655
    Application Date: 2007-08-15
  • Publication No.: US08227284B2
    Publication Date: 2012-07-24
  • Inventor: Hisayuki MikiKenzo HanawaYasumasa Sasaki
  • Applicant: Hisayuki MikiKenzo HanawaYasumasa Sasaki
  • Applicant Address: JP Tokyo
  • Assignee: Showa Denko K.K.
  • Current Assignee: Showa Denko K.K.
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2006-223260 20060818; JP2006-223261 20060818; JP2006-291082 20061026
  • International Application: PCT/JP2007/065902 WO 20070815
  • International Announcement: WO2008/020599 WO 20080221
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Group-III nitride compound semiconductor light-emitting device, method of manufacturing group-III nitride compound semiconductor light-emitting device, and lamp
Abstract:
The present invention provides a group-III nitride compound semiconductor light-emitting device having high productivity and good emission characteristics, a method of manufacturing a group-III nitride compound semiconductor light-emitting device, and a lamp. A method of manufacturing a group-III nitride compound semiconductor light-emitting device includes a step of forming on a substrate 11 a semiconductor layer made of a group-III nitride compound semiconductor including Ga as a group-III element using a sputtering method. The substrate 11 and a sputtering target are arranged so as to face each other, and a gap between the substrate 11 and the sputtering target is in the range of 20 to 100 mm. In addition, when the semiconductor layer is formed by the sputtering method, a bias of more than 0.1 W/cm2 is applied to the substrate 11. Further, when the semiconductor layer is formed, nitrogen and argon are supplied into a chamber used for sputtering.
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