Invention Grant
- Patent Title: Die stacking with an annular via having a recessed socket
- Patent Title (中): 具有凹入插座的环形通孔的芯片堆叠
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Application No.: US13117677Application Date: 2011-05-27
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Publication No.: US08227343B2Publication Date: 2012-07-24
- Inventor: Dave Pratt
- Applicant: Dave Pratt
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A die stack including a die having an annular via with a recessed conductive socket and methods of forming the die stack provide a structure for use in a variety of electronic systems. In an embodiment, a die stack includes a conductive pillar on the top of a die inserted into the recessed conductive socket of another die.
Public/Granted literature
- US20110226730A1 DIE STACKING WITH AN ANNULAR VIA HAVING A RECESSED SOCKET Public/Granted day:2011-09-22
Information query
IPC分类:
