Invention Grant
- Patent Title: Curable epoxy resin composition and cured product thereof
- Patent Title (中): 可固化环氧树脂组合物及其固化产物
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Application No.: US12675499Application Date: 2008-08-19
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Publication No.: US08227528B2Publication Date: 2012-07-24
- Inventor: Yoshitsugu Morita , Hiroshi Ueki
- Applicant: Yoshitsugu Morita , Hiroshi Ueki
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2007-227140 20070831
- International Application: PCT/JP2008/065066 WO 20080819
- International Announcement: WO2009/028432 WO 20090305
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08K3/36
Abstract:
A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 μm, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.
Public/Granted literature
- US20100216913A1 Curable Epoxy Resin Composition and Cured Product Thereof Public/Granted day:2010-08-26
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