Invention Grant
- Patent Title: Pressure-sensitive adhesive sheet
- Patent Title (中): 压敏粘合片
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Application No.: US12792841Application Date: 2010-06-03
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Publication No.: US08227533B2Publication Date: 2012-07-24
- Inventor: Akiko Takahashi , Hiroshi Wada , Tomonari Naito
- Applicant: Akiko Takahashi , Hiroshi Wada , Tomonari Naito
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-303090 20041018
- Main IPC: C08L93/04
- IPC: C08L93/04

Abstract:
A pressure-sensitive adhesive sheet has a high adhesiveness and an excellent terminal peeling resistance as well as exhibits extremely small diffusing amounts of formaldehyde and toluene. The pressure-sensitive adhesive sheet contains at least a pressure-sensitive adhesive layer of a water-dispersion type acrylic pressure-sensitive adhesive containing a water-dispersion type acrylic polymer and a tackifying resin-containing emulsion, wherein a diffusing amount of formaldehyde is less than 3 μg/m3 and a diffusing amount of toluene is 10 μg/g or less. As the tackifying resin-containing emulsion, a tackifying resin-containing emulsion prepared using substantially no organic solvents or a tackifying resin-containing emulsion prepared using a material other than aromatic hydrocarbon-based organic solvents can be suitably employed.
Public/Granted literature
- US20100239804A1 Pressure-Sensitive Adhesive Sheet Public/Granted day:2010-09-23
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