Invention Grant
- Patent Title: Solder bonding method and apparatus
- Patent Title (中): 焊接方法和装置
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Application No.: US12581728Application Date: 2009-10-19
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Publication No.: US08227723B2Publication Date: 2012-07-24
- Inventor: Eric Benson , Danny Cam Lu , Jeffrey S. Sullivan
- Applicant: Eric Benson , Danny Cam Lu , Jeffrey S. Sullivan
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: B23K1/00
- IPC: B23K1/00

Abstract:
The present invention generally relates to a module and process for automatically attaching a junction box to a composite solar cell structure during the fabrication of a completed solar cell device. The electrical connection module further provides a thermode assembly including heating elements for forming a soldered connection between the junction box and the composite solar cell structure and a temperature sensing device in thermal communication with the heating elements for detecting a temperature profile during the connection process. The heating elements and temperature sensing device are linked to a controller configured to monitor and compare the energy input into the heating elements with the temperature near the tip of the heating elements throughout the connection process. The controller is further configured to compare the actual energy versus temperature profile to an expected profile throughout the connection process and verify whether a quality bond is achieved.
Public/Granted literature
- US20110089145A1 SOLDER BONDING METHOD AND APPARATUS Public/Granted day:2011-04-21
Information query
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