Invention Grant
US08227814B2 Semiconductor device and manufacturing method thereof, and camera module including the same
有权
半导体装置及其制造方法以及包括该半导体装置的相机模块
- Patent Title: Semiconductor device and manufacturing method thereof, and camera module including the same
- Patent Title (中): 半导体装置及其制造方法以及包括该半导体装置的相机模块
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Application No.: US13117803Application Date: 2011-05-27
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Publication No.: US08227814B2Publication Date: 2012-07-24
- Inventor: Shoichi Tanaka , Hiroto Ohsaki
- Applicant: Shoichi Tanaka , Hiroto Ohsaki
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-317305 20071207
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/267 ; H01L31/12
Abstract:
A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.
Public/Granted literature
- US20110227115A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND CAMERA MODULE INCLUDING THE SAME Public/Granted day:2011-09-22
Information query
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