Invention Grant
- Patent Title: LED array package covered with a highly thermal conductive plate
- Patent Title (中): LED阵列封装覆盖有高导热板
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Application No.: US12958303Application Date: 2010-12-01
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Publication No.: US08227828B2Publication Date: 2012-07-24
- Inventor: Jianhua Li , Rene Helbing , David Hum
- Applicant: Jianhua Li , Rene Helbing , David Hum
- Applicant Address: US CA Livermore
- Assignee: Bridgelux, Inc.
- Current Assignee: Bridgelux, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Arent Fox LLP
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate.
Public/Granted literature
- US20110073878A1 LED ARRAY PACKAGE COVERED WITH A HIGHLY THERMAL CONDUCTIVE PLATE Public/Granted day:2011-03-31
Information query
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