An integrated circuit device includes a semiconductor substrate having a first region and second region, a conductive via positioned in the first region of the semiconductor substrate, at least one active element positioned in the second region of the semiconductor substrate, a conductive layer extending from the first region to the second region and electrically connecting the conductive via to the active element, and an auxiliary structure positioned in the first region of the semiconductor substrate and proximate to the conductive via. The auxiliary structure can be a stress-absorbing structure, and the volume of the stress-absorbing structure decreases as the volume of the conductive via increases. The auxiliary structure can be a heat-evacuating structure, and the heat-evacuating structure is configured to transfer the operating heat generated by the active element from the first region of the semiconductor substrate to the conductive via through the conductive layer.