Invention Grant
US08227871B2 Semiconductor device and method for manufacturing the same 有权
半导体装置及其制造方法

Semiconductor device and method for manufacturing the same
Abstract:
A semiconductor device and a method for manufacturing the same are disclosed. The semiconductor device includes a substrate having a first conductor-type, a buried layer of a second conductor-type on the substrate, a drain, and a first guard-ring on one side of the drain, a second guard-ring on one side of the first guard-ring, and a third guard-ring on one side of the second guard-ring.
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