Systems and methods for mounting inertial sensors on a board. On a wafer containing one or more sensor packages having a substrate layer, a sensor layer and an insulator layer located between the sensor layer and the substrate layer, a V-groove is anisotropically etched into one of the substrate layer. The substrate layer is in the 100 crystal plane orientation. The sensor package is then separated from the wafer. Then, a surface of the substrate layer formed by the etching is attached to a board. In one example, three sensor packages are mounted to the board so that their sense axis are perpendicular to each other.