Invention Grant
- Patent Title: Alignment for backside illumination sensor
- Patent Title (中): 背面照明传感器对准
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Application No.: US12553586Application Date: 2009-09-03
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Publication No.: US08227899B2Publication Date: 2012-07-24
- Inventor: Jen-Cheng Liu , Dun-Nian Yaung , Shou-Gwo Wuu
- Applicant: Jen-Cheng Liu , Dun-Nian Yaung , Shou-Gwo Wuu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/544
- IPC: H01L23/544
Abstract:
Provided is an apparatus that includes an integrated circuit located in a first region of a substrate having first and second opposing major surfaces and an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces.
Public/Granted literature
- US20090321888A1 ALIGNMENT FOR BACKSIDE ILLUMINATION SENSOR Public/Granted day:2009-12-31
Information query
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