Invention Grant
- Patent Title: Structures for preventing cross-talk between through-silicon vias and integrated circuits
- Patent Title (中): 用于防止硅通孔和集成电路之间串扰的结构
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Application No.: US11945022Application Date: 2007-11-26
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Publication No.: US08227902B2Publication Date: 2012-07-24
- Inventor: Chen-Cheng Kuo
- Applicant: Chen-Cheng Kuo
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
A semiconductor chip includes a through-silicon via (TSV), a device region, and a cross-talk prevention ring encircling one of the device region and the TSV. The TSV is isolated from substantially all device regions comprising active devices by the cross-talk prevention ring.
Public/Granted literature
- US20090134500A1 Structures for Preventing Cross-talk Between Through-Silicon Vias and Integrated Circuits Public/Granted day:2009-05-28
Information query
IPC分类:
