Invention Grant
US08228075B2 Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
有权
用于射频IC器件的测试系统及使用其的射频IC器件的制造方法
- Patent Title: Test system for radio frequency IC devices and method of manufacturing radio frequency IC devices using the same
- Patent Title (中): 用于射频IC器件的测试系统及使用其的射频IC器件的制造方法
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Application No.: US12388826Application Date: 2009-02-19
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Publication No.: US08228075B2Publication Date: 2012-07-24
- Inventor: Yuya Dokai , Noboru Kato
- Applicant: Yuya Dokai , Noboru Kato
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-227591 20060824
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
A test system for a radio frequency IC device includes a radio frequency IC chip and a radiation strip. The characteristics of the radio frequency IC device are measured by bringing the tip of a probe of a test apparatus in direct contact with a portion of the radiation strip and thereby providing a radio frequency signal. The tip of the probe is made to be a flat plate so as to obtain closer and more stable contact with the radiation strip.
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