Invention Grant
- Patent Title: Heat-dissipating wireless communication system
- Patent Title (中): 散热无线通信系统
-
Application No.: US11344296Application Date: 2006-01-31
-
Publication No.: US08228239B2Publication Date: 2012-07-24
- Inventor: Isaac Lagnado , Timothy Neill , Mark S. Tracy , Jeffrey A. Lev , Walter G. Fry
- Applicant: Isaac Lagnado , Timothy Neill , Mark S. Tracy , Jeffrey A. Lev , Walter G. Fry
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01Q1/24
- IPC: H01Q1/24
Abstract:
A heat-dissipating wireless communication system for a computer device comprises an antenna configured for wireless communications, the antenna configured to dissipate heat generated by the computer device.
Public/Granted literature
- US20070176831A1 Heat-dissipating wireless communication system Public/Granted day:2007-08-02
Information query
