Invention Grant
- Patent Title: Component assembly and electronic apparatus
- Patent Title (中): 组件组件和电子设备
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Application No.: US12222961Application Date: 2008-08-20
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Publication No.: US08228446B2Publication Date: 2012-07-24
- Inventor: Hideyuki Fujikawa
- Applicant: Hideyuki Fujikawa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2007-308875 20071129
- Main IPC: H04N7/18
- IPC: H04N7/18

Abstract:
A component assembly includes a first component having a locking section and a flat-plate shaped projection formed on a first face. The locking section extends from the first face and bends in a first direction. The projection extends perpendicularly to the first face and is formed of a face intersecting the first direction. The assembly also includes a second component having a first hole and a second formed on a first face. The locking section of the first component is inserted into the first hole, and the projection of the first component is inserted into the second hole. The first face of the second component opposes the first face of the first component and includes a part with a slope section on which the distal end of the projection abuts and which moves the first component in the first direction when the first component is attached to the second component.
Public/Granted literature
- US20090141199A1 Component assembly and electronic apparatus Public/Granted day:2009-06-04
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